The proper connection of the leads of an electronic component – capacitors, inductors, resistors, ICs – into the substrate is critical for mechanical and electrical reasons. The improper fill of a through hole via (or barrel) can lead to improper electrical performance and early mechanical fatigue of the assembly.
The proper connection of the leads of a connector into the substrate is critical for mechanical and electrical reasons. Improperly filled vias can lead to the premature mechanical or electrical failure of the connector, thus shortening the assembly’s lifespan.
Thermal vias are filled to reduce the thermal impedance between layers of a printed circuit board. They are critical, for example, to dissipate the heat from power devices – from the thermal pad to an internal thermal layer. The improper fill of these vias can lead to the premature failure of the power device, damage to the board, or both.
