Aerospace Industry

As far back as we can tell, man has always dreamed of flying. As the first craft were built for personal use, the cost of failure was relatively low compared to the aircraft we build today. From fighter jets to mammoth passenger planes, failure is simply not an option.

Unfortunately, potential failures come from a multitude of directions: counterfeit circuit chips, excessive voiding on QFNs and BGAs, insufficient fill on a through-hole via or connector pin, missing or misplaced parts, or inordinate porosity.

Fortunately, TruView™ X-ray systems can help you find these problems before they become a failure.

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Building critical parts with counterfeit components can be disastrous. Rely on TruView™ X-ray systems to verify parts before installation.


Losing time due to insufficient parts can be incredibly costly. Rely on TruView™ X-ray systems to keep your inventory accurately counted.


The solder joints on bottom-terminated components such as BGAs and QFNs are largely hidden from even the best microscopes. TruView™ X-ray inspection can see through the component to see the solder pads and voiding hidden beneath it.

Bottom-Terminated<br>Components<br>(BGA, QFN, CSP)

Through hole via, or barrel, fill is critical for electrical connection as well as mechanical strength. With TruView™ X-ray systems, you can see into the barrel or have them automatically measured for pass/fail analysis.

Through<br>Hole Via

There isn’t much more reassuring on a high-reliability product than to have a final X-ray inspection of the product to verify that all the parts are where they should be. Confirming orientation of a needle, the right number of coils on a spring, or the proper amount of fill in a vial are all crucial.

Parts &<br>Placement

LEDs are great, but voids can turn great, faithful products into unreliable components with a shorter lifespan than an incandescent bulb. Trust a TruView™ system to verify your voiding is within specifications.

LED and Power<br>Devices

Packaging of an integrated circuit is a very fine process. Once packaged, it is all invisible from an optical perspective. X-ray enables you to look through the resin at the die, lead frame, and wire bonds.

IC Packaging, PoP,<br>Wirebonds

Making a strong and durable connection is critical for any system. Knowing that your pin connectors’ wells are full of solder gives you the confidence to deliver on the promises made to your customers. TruView™ X-ray inspection will help you truly come through.

Cables &<br>Connectors

There are many layers to battery inspection. Depending on the battery type, resolving the layers themselves can be critical. The anode and cathode connections presence and alignment not only show pass/fail but also are signs of counterfeits.


3D printing, or additive manufacturing, is still progressing strongly. Seeing the internal structure, porosity, and other defects is a huge advantage towards making strong designs.

3D Printing

Critical castings should be inspected for weak spots due to porosity as well as shrinkage and hot tears.


Computed Tomography, or CT, is valuable tool for inspecting products in full 3D. The product is spun a full 360 degrees while hundreds or thousands of X-ray images are acquired. Powerful software then reconstructs a model that can be spun, sliced, and even printed with additive manufacturing.

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